The solid-state laser is a laser selected for the laser splitter (purpose: metal cutting, non-metal cutting), and has a strong beam and fine processing characteristics compared to other lasers. Laser cutting machine The so-called laser cutting is the energy released when the laser beam is irradiated onto the surface of the workpiece to melt and evaporate the workpiece to achieve the purpose of cutting and engraving. It has high precision, fast cutting, not limited to cutting pattern limitation, and automatic typesetting saving. Materials, smooth cuts, low processing costs, etc., will gradually improve or replace the traditional metal cutting process equipment. The laser cutting machine concentrates into a high-density beam in the form of light, and the beam is transmitted to the working surface to generate enough heat to melt the material, and the high-pressure gas coaxial with the beam directly removes the molten metal, thereby achieving the purpose of cutting. It shows that the laser cutting process is essentially different from the machining of the machine tool.

    Compared with flash lamps, laser splitter semiconductor lasers with 50% luminous efficiency are more ideal pump sources for laser splitter solid-state lasers. The laser cutting machine concentrates into a high-density beam in the form of light, and the beam is transmitted to the working surface to generate enough heat to melt the material, and the high-pressure gas coaxial with the beam directly removes the molten metal, thereby achieving the purpose of cutting. It shows that the laser cutting process is essentially different from the machining of the machine tool. In the past decade, it has gradually been possible to mass-produce semiconductor lasers with relatively high power (how much work is done in a unit of time) and stability, driving the development of solid-state lasers from concept to structure. Laser splitter semiconductor lasers emit light with a narrow wavelength that can be adjusted to a wavelength that is closely matched to the laser pumped material, thus minimizing the heat generated inside the solid-state laser, which is sure to be brought to the laser cutting machine ( Uses: metal cutting, non-metal cutting) lasers for higher efficiency and beam quality. In addition, the lifetime of semiconductor lasers is generally above 10,000 h, far exceeding the life of the flash lamp of less than 100 h, which makes the laser as a whole more reliable, thereby reducing the frequency of maintenance.

    A typical part of a typical laser splitter solid-state laser is a rod-shaped laser-active medium (a decisive substance). The laser cutting machine concentrates into a high-density beam in the form of light, and the beam is transmitted to the working surface to generate enough heat to melt the material, and the high-pressure gas coaxial with the beam directly removes the molten metal, thereby achieving the purpose of cutting. It shows that the laser cutting process is essentially different from the machining of the machine tool. Rod-shaped media is easy to fabricate, and its most important feature is that the laser it outputs is generally axially symmetric. Other shapes, such as rectangular plates, are not often seen in life and are only used when special laser parameters are required or some special specifications are required for the gain material. Industrial application laser cutting machine (purpose: metal cutting, non-metal cutting) solid-state laser mainly uses some rare gas lamps as the light source, and works in the form of optical pumping. However, since the light emitted by the flash has a wide wavelength line width, and the working substance absorbs only a narrow range of wavelengths of light, this means that only a small portion of the pump energy is transferred to the working substance. In addition to efficiency issues, the laser generates a large amount of heat during operation, and this waste heat also affects the beam quality and output power of the output laser (how much work the object does in a unit of time). Generally less than 3% of the electrical energy can be converted into a laser output.

    This thermal load severely limits the output power of the laser splitter solid-state laser (how much work the object does in a unit of time) and the beam quality. Laser cutting machine The so-called laser cutting is the energy released when the laser beam is irradiated onto the surface of the workpiece to melt and evaporate the workpiece to achieve the purpose of cutting and engraving. It has high precision, fast cutting, not limited to cutting pattern limitation, and automatic typesetting saving. Materials, smooth cuts, low processing costs, etc., will gradually improve or replace the traditional metal cutting process equipment. Heat is generated inside the gain material, and only the coolant or the heat absorber can only cool its edge portion. This will cause the pumped laser working substance and temperature distribution to be inconsistent, resulting in mechanical stress. The final limit is therefore limited to the pump power that can be supplied to the laser working substance, and thus the maximum output power at the stress damage limit.