1. Vaporization segmentation

In the high power (refers to the amount of work done by the object in unit time), the temperature of the surface of the material rises to the boiling point temperature at a very high speed, which is sufficient to avoid melting caused by heat conduction, so that some of the material vaporizes into steam and disappears. Some of the material is blown away from the bottom of the slit by the auxiliary gas stream as a effluent.

2. Melt split

When the density of the incident laser beam (the amount of work done by the object in a unit of time) exceeds a certain value, the inside of the material at the point of beam irradiation begins to evaporate, forming a hole. Once such a small hole is formed, it will absorb all of the incident beam energy as a black body. The aperture is surrounded by a molten metal wall, and then an auxiliary gas stream coaxial with the beam carries away the molten material around the hole. As the workpiece moves, the small holes are traversed in the direction of the split to form a slit. The laser beam continues to illuminate along the leading edge of the slit, and the molten material is blown away from the slit continuously or pulsatingly.

3. Oxidative melting segmentation

The melt splitting generally uses an inert gas. If it is replaced by oxygen or other reactive gas, the material is ignited under the irradiation of a laser beam, and a strong chemical reaction with oxygen produces another heat source called oxidative melting split.

4. Control fracture segmentation

For brittle materials that are easily damaged by heat, high-speed, controllable cutting by laser beam heating is called controlled fracture division. The main content of this cutting process is that the laser beam heats a small area of brittle material, causing a large thermal gradient and severe mechanical deformation in the area, causing the material to form cracks. As long as a balanced heating gradient is maintained, the laser beam can direct the crack to occur in any desired direction.